https://www.linkedin.com/in/valeri-anpilovv-128988163/

Anpilov

Valery

Nikolaevich

Date of birth:

01 May 1962

Nationality:

Russian

Education:

·       1992-1995 – PhD , Leningradsky state university https://english.spbu.ru
(Numerical simulation of propagation phenomena of strong shock waves in heterogeneous elastic-plastic media)

·       1981-1986 – Leningradsky state university https://english.spbu.ru
Department: Applied mathematics

·       1981-1986 – Engineering academy.
Specialization: Stress simulations.
Probation and stress simulation of underground constructions for the effects of waves from explosions of conventional and nuclear munitions.

·       1978-1981 – Engineering college.
Specialization: Stress simulations. Diploma with honours.

Training Courses & Continuing Education

·        Full course of lectures and seminars at MIPT https://mipt.ru/english/ :
- Computational Mathematics

- Nonlinear computing processes

- Mechanics (including seminars)

- Optics (including seminars)

- Theories of probability (including seminars)

- Electricity and magnetism (including seminars)

·        Lectures and seminars of Lomonosov Moscow State University https://www.msu.ru/en/ :

- Computational Mathematics

- Differential equations. (including seminars)

- Mechanics. (Including seminars)

- Classical mechanics. (Including seminars)

- Theoretical mechanics. (Including seminars)

- Mechanics of continuous media. (including seminars)

- Optics. (including seminars)

- Theory of waves.

- Theory of oscillations.

- Thermodynamics and statistical physics.

- Electromagnetism.

From January 2019 – present: Krets Consulting (Orebro, Sweden)

(https://krets.nu/hem/)

 Stress&thermal&EMag engineer-consultant

 Stress & thermal & Emag simulations

Working experience:

 2008 – present :Engineering company «CAE-Services»

http://cae-services.net/

Chief of stress department

 Stress/thermal simulations:

·      Stress/thermal simulations of the overall stress-strain state of piping systems made from both metal and non-metal (including composites) materials, for given values of temperature, pressure, weight of the internal environment, self-weight of the structure, taking into account the kinematic conditions, as well as the friction in the bearings.
Material of pipes, vessels and tanks:

-        steel

-        plastic/polimer

-        rubber

-        composities.

·        Seismic resistance of tanks and pressure vessels, including partially filled with liquid.
 – coupled Eulerian-Lagrangian (CEL) analysis was used for fluid-structure interaction.

·        Stress simulation taking into account the hyperelastic properties of gaskets from rubbers and polymers.

·        Stress simulations with composites (small experience).

·        Numerical simulation of stamping processes.

·        Stress simulations of lift's constructions under "operational" and "emergency" loads, in particular:

-        emergency lift stops;

-        lift containing passengers falling onto shock absorbers.

·        Stress simulations of the container in which the electronic units and diesel generators of backup electricity are located to the effect of static and dynamic (seismic) loads.

·        Stress simulations of the parts / assemblies of various metalworking machines.

·        Stress simulations of a metal-ceramic tube (heat exchanger element of a nuclear reactor) for various internal pressure and temperature.

·        Stress simulations (static and dynamics) for electronic, electrical and optical devices under structural and thermal loads.

·        Multibody Dynamics Modeling (COMSOL - from 2017)

·        Rotor Dynamics Modeling (COMSOL - from 2018)

·        Analysis of Thermoelectric Phenomena with COMSOL (from 2017)

·        Piezoelectric Simulations with COMSOL (from 2017)

 1995 – 2008 –office of German company CAD-FEM GmbH in Russia

www.cadfem.de (Technical Director – Chief stress department)

Stress/thermal simulations for electronic industry:

·        Stress simulations (static and dynamics) for electronic, electrical and optical devices under structural and thermal loads.

·        Determination of the stresses in microcircuits from thermal loads.

·        Numerical modeling of technological operations in the manufacture of metal parts (stamping) - to use deformed geometry and calculation results (residual stresses , residual deformations, viscous fracture) in further stress simulations.

·        Stress simulation in order to obtain data on the strength of the soldering of electronic parts on the boards.

·        Stress simulations of the electrical connectors for determining the degree of their reliability, as well as the contact areas at different temperatures.

·        Linear dynamics, frequency and spectral simulations.

·        Determination of the optimal damping system (vibration isolation, shock absorber) for individual electronic components, boards and electronic devices.

·        Stress simulations with respect to hyperelastic (hyperelastic, hyperfoam) properties of gaskets and shock absorbers made of rubbers and polymers.

·        Stress simulations of plastics (polymers) parts – with respect to viscoelasticity and viscoplasticity.

·        small experience with stress simulations of reinforced polymeric composites.

1986–1995  Research Institute

Stress engineer

·        Coupled stress / thermal simulations - propagation of explosion shock waves in elastoplastic media (soild) and interaction of shock waves with above-ground and underground structures, pipelines, tanks.

·        Determination of parameters of motion underground constru